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Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device
Chia Wen Tsao
, Chang Yen Chang, Po Yen Chien
機械工程學系
研究成果
:
雜誌貢獻
›
期刊論文
›
同行評審
4
引文 斯高帕斯（Scopus）
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指紋
研究計畫
(1)
指紋
深入研究「Microwave-Assisted Solvent Bonding for Polymethyl Methacrylate Microfluidic Device」主題。共同形成了獨特的指紋。
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Keyphrases
Acetone
33%
Bond Performance
33%
Bonding Interface
33%
Bonding Process
66%
Bonding Strength
66%
Complex Procedure
33%
Controlled Experiment
33%
Dielectric Heating
33%
Direct Bonding
33%
Ethanol
33%
Force Application
33%
Geometric Stability
33%
Heating Control
33%
Microfluidic Applications
33%
Microfluidic Device
100%
Microwave Assistance
66%
Microwave Irradiation
33%
Microwave-assisted
100%
Non-heating
33%
Organic Solvents
66%
Oven Heating
33%
Poly(methyl methacrylate)
100%
Solvent Bonding
100%
Stability Strength
33%
Engineering
Bonding Strength
100%
Control Experiment
50%
Dielectrics
50%
Direct Bonding
50%
Microchannel
50%
Microfluidic Device
100%
Ultimate Tensile Strength
50%
Chemistry
Dielectric Material
33%
Methacrylate
100%
Microwave Irradiation
33%
Tensile Strength
33%
Thermoplastics
100%
Material Science
Dielectric Material
33%
Mechanical Strength
33%
Organic Solvents
66%
Thermoplastics
100%
Ultimate Tensile Strength
33%
Chemical Engineering
Dielectric Heating
33%
Polymethyl Methacrylate
100%
Thermoplastics
100%