@inproceedings{61f8f7451ff24bd0bed6730bf47c49cd,
title = "Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction",
abstract = "Under constant current electromigration, white tin (β-Sn) exhibited a resistance drop of up to 10%. It has a body-center tetragonal (BCT) structure, and the resistivity along the a and b axes is 35% smaller than that along the c axis. Microstructure evolution under electromigration could be responsible for the resistance drop. Synchrotron radiation white beam x-ray microdiffraction was used to study this evolution. Both stress and grain orientation was studied. Grain-by-grain analysis was obtained from the diffracted Laue patterns about the changes of grain orientation during electromigration testing in ex-situ and in-situ samples. We observed that high resistance grains re-orient with respect to the neighboring low resistance grains, most likely by grain rotation of the latter. A different mechanism of microstructure evolution under electromigration from the normal grain growth is proposed and discussed.",
author = "Wu, {Albert T.} and Lloyd, {J. R.} and N. Tamura and Tu, {K. N.}",
year = "2005",
doi = "10.1109/ISAPM.2005.1432073",
language = "???core.languages.en_GB???",
isbn = "0780390857",
series = "Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces",
pages = "178--180",
booktitle = "Proceedings - 2005 10th International Symposium on Advanced Packaging Materials",
note = "2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces ; Conference date: 16-03-2005 Through 18-03-2005",
}