Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

C. Y. Liu; Chih Chen; C. N. Liao; K. N. Tu

doi:10.1063/1.124276

Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

C. Y. Liu, Chih Chen, C. N. Liao, K. N. Tu

化學工程與材料工程學系

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

171 引文斯高帕斯（Scopus）

摘要

Under room temperature electromigration, hillock and void formations were observed in a eutectic SnPb solder stripe. At the anode, hillocks originated from the Pb grains and were extruded under a compressive stress due to the incoming flux of Sn atoms. The morphology of the voids at the cathode also indicates that the Sn grains were depleted during the process.

原文	???core.languages.en_GB???
頁（從 - 到）	58-60
頁數	3
期刊	Applied Physics Letters
卷	75
發行號	1
DOIs	https://doi.org/10.1063/1.124276
出版狀態	已出版 - 5 7月 1999

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10.1063/1.124276

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AB - Under room temperature electromigration, hillock and void formations were observed in a eutectic SnPb solder stripe. At the anode, hillocks originated from the Pb grains and were extruded under a compressive stress due to the incoming flux of Sn atoms. The morphology of the voids at the cathode also indicates that the Sn grains were depleted during the process.

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Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

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