Micro-hole machining using micro-EDM combined with electropolishing

Jung Chou Hung, Biing Hwa Yan, Hung Sung Liu, Han Ming Chow

研究成果: 雜誌貢獻期刊論文同行評審

34 引文 斯高帕斯(Scopus)

摘要

This paper presents a novel process of using micro-electro-discharge- machining (micro-EDM) combined with electropolishing to improve the surface roughness of micro-holes. During the machining process, a tool is fabricated by wire electro-discharge grinding (WEDG) directly by using micro-EDM for machining the micro-hole and by electropolishing to finish the hole wall. In this work, various micro-holes are machined on the high nickel alloy. By the electropolishing method, high surface quality of the hole wall is obtained by applying a suitable electrolytic voltage and an appropriate concentration of electrolyte in about 5 min of machining time. The taper and burrs of the inlet of holes are reduced, even for difficult- to-machine special-shaped micro-holes. The surface roughness reduced from 2.11 νm Rmax before grinding to 0.69 νm Rmax after electropolishing.

原文???core.languages.en_GB???
文章編號007
頁(從 - 到)1480-1486
頁數7
期刊Journal of Micromechanics and Microengineering
16
發行號8
DOIs
出版狀態已出版 - 1 8月 2006

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