Method for determining the junction temperature of alternating current light-emitting diodes

F. S. Hwu, G. J. Sheu, M. T. Lin, J. C. Chen

研究成果: 雜誌貢獻期刊論文同行評審

10 引文 斯高帕斯(Scopus)

摘要

A numerical simulation was used to simulate the temperature distribution during AC and DC operations of an alternating current light-emitting diode (AC LED). The relationship between the junction temperature and the temperature at the centre of the bottom surface of the submount of an AC LED was measured under DC operation. This relationship was confirmed by numerical simulation. The numerical results were consistent with the experimental observations in that the temperature at the centre of the bottom surface of the submount was insensitive to the current variations that occur in an AC LED, probably because of the large mass of the submount. However, it was difficult to measure the temperature oscillation at the junctions in an AC LED, although this oscillation can be clearly seen in the numerical results. Thus, the authors propose a formula for predicting the range of the oscillating junction temperature for an AC LED.

原文???core.languages.en_GB???
頁(從 - 到)159-164
頁數6
期刊IET Science, Measurement and Technology
3
發行號2
DOIs
出版狀態已出版 - 2009

指紋

深入研究「Method for determining the junction temperature of alternating current light-emitting diodes」主題。共同形成了獨特的指紋。

引用此