@inproceedings{d8006c367de24ca2a14b7052fdc074e2,
title = "Metallic wafer and chip bonding for LED packaging",
abstract = "LED chip bonding on Cu foil have been investigated. We found that with thicker Cu coating on the back side of LED chip, a better lighting efficiency will be obtained, Indium(In) chip bonding shows slightly better thermal dissipation than Sn chip bonding. Also, a new wafer bonding for producing GaN on Si substrate have been successfully demonstrated. This technique enables us to produce a high temperature bonding by using a low temperature process.",
author = "Hsu, {C. C.} and Wang, {S. J.} and Liu, {C. Y.}",
note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 5th Pacific Rim Conference on Lasers and Electro-Optics, CLEO/Pacific Rim 2003 ; Conference date: 15-12-2003 Through 19-12-2003",
year = "2003",
doi = "10.1109/CLEOPR.2003.1274506",
language = "???core.languages.en_GB???",
series = "Pacific Rim Conference on Lasers and Electro-Optics, CLEO - Technical Digest",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "26",
booktitle = "CLEO/Pacific Rim 2003 - 5th Pacific Rim Conference on Lasers and Electro-Optics",
}