Mechanical and thermal behaviors of nitrogen-doped Zr-Cu-Al-Ag-Ta - An alternative class of thin film metallic glass

Pao Sheng Chen, Hsien Wei Chen, Jenq Gong Duh, Jyh Wei Lee, Jason Shian Ching Jang

研究成果: 雜誌貢獻期刊論文同行評審

22 引文 斯高帕斯(Scopus)

摘要

Super-plasticity and nano-scale surface roughness make thin film metallic glass (TFMG) a candidate for master mold of micro/nano imprint technique. Meanwhile, better mechanical properties of TFMG undoubtedly expand the life time of master mold. In this study, nitrogen is doped into Zr-based TFMG to exhibit the hardness higher than 10 GPa. Different from elements used to be doped into metallic glass, the role of nitrogen atoms plays in metallic glass is distinct and vital owing to its strong electronegativity. From the correlation of thermal and mechanical behavior, the role and effect of nitrogen in Ta-Zr-Cu-Al-Ag TFMG is discussed and proposed.

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文章編號181902
期刊Applied Physics Letters
101
發行號18
DOIs
出版狀態已出版 - 29 10月 2012

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