@inproceedings{9eaa9c87b4ce4e57b1eb7e953a426e2f,
title = "Massive spalling in Pb-free solder on co-based surface finishes",
abstract = "This paper investigates massive spalling that occurs in the intermetallic compounds at the interfaces between Pb-free SAC 305 and Co-based surface finishes. The SAC 305 solders were reflowed on the Co-based substrates and aged at different conditions. The samples were cross-sectioned to study the interfacial morphology. The occurrence of massive spalling depends on the constituents of the substrates. Shear tests were performed on the samples to evaluate the influence of massive spalling on the mechanical strength of the joints. The results indicated that massive spalling did not deteriorate the joint strength.",
keywords = "Cobalt, massive spalling, shear strenrth, surface finish",
author = "Huang, {Chun Hao} and Tsai, {Yi Ling} and Chang, {Yu Ting} and Wu, {Albert T.}",
note = "Publisher Copyright: {\textcopyright} 2015 The Japan Institute of Electronics Packaging.; null ; Conference date: 14-04-2015 Through 17-04-2015",
year = "2015",
month = may,
day = "20",
doi = "10.1109/ICEP-IAAC.2015.7111082",
language = "???core.languages.en_GB???",
series = "ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "586--589",
booktitle = "ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference",
}