Massive spalling in Pb-free solder on co-based surface finishes

Chun Hao Huang, Yi Ling Tsai, Yu Ting Chang, Albert T. Wu

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

This paper investigates massive spalling that occurs in the intermetallic compounds at the interfaces between Pb-free SAC 305 and Co-based surface finishes. The SAC 305 solders were reflowed on the Co-based substrates and aged at different conditions. The samples were cross-sectioned to study the interfacial morphology. The occurrence of massive spalling depends on the constituents of the substrates. Shear tests were performed on the samples to evaluate the influence of massive spalling on the mechanical strength of the joints. The results indicated that massive spalling did not deteriorate the joint strength.

原文???core.languages.en_GB???
主出版物標題ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
發行者Institute of Electrical and Electronics Engineers Inc.
頁面586-589
頁數4
ISBN(電子)9784904090138
DOIs
出版狀態已出版 - 20 5月 2015
事件2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
持續時間: 14 4月 201517 4月 2015

出版系列

名字ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference

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???event.eventtypes.event.conference???2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
國家/地區Japan
城市Kyoto
期間14/04/1517/04/15

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