Low-Temperature Rough-Surface Wafer Bonding with AlN/AlN Via Oxygen Plasma Activation

Keyphrases

• Al Pairs 50%
• Alumina Layer 50%
• Aluminum Oxide 50%
• Annealing 50%
• Bonding Interface 100%
• Bonding Surface 50%
• By Design 50%
• Capillary Action 50%
• Ceramic Materials 50%
• Dehydration 50%
• Dielectric Properties 50%
• Direct Wafer Bonding 50%
• Electron Transfer 50%
• Hydrolysis 50%
• Hydrophilic Surface 50%
• Low Temperature 100%
• Low-temperature Annealing 50%
• Microelectronics 50%
• Nitrides 50%
• Nitrogen Concentration 50%
• Oxygen Concentration 50%
• Oxygen Plasma 50%
• Oxygen Plasma Treatment 100%
• Rough Surface 100%
• Roughness Surface 50%
• Scanning Electron Microscopy 50%
• Sintered Aluminum 50%
• Thermal Properties 50%
• Transition Layer 50%
• Wafer 100%
• Wafer Bonding 100%

Engineering

• Aluminum Oxide 33%
• Bonding Pair 33%
• Capillary Action 33%
• Dielectrics 33%
• Energy Engineering 33%
• Hydrophilic Surface 33%
• Hydrophobic 33%
• Low-Temperature 100%
• Microelectronics 33%
• Nitride 33%
• Oxygen Concentration 33%
• Plasma Activation 100%
• Sintering 33%
• Wafer Bonding 100%

Material Science

• Al2O3 7%
• Aluminum Nitride 100%
• Aluminum Oxide 7%
• Ceramic Material 7%
• Dielectric Property 7%
• Electron Transfer 7%
• Enzymatic Hydrolysis 7%
• Rough Surface 100%
• Scanning Electron Microscopy 7%
• Sintering 7%
• Surface (Surface Science) 28%
• Surface Roughness 7%
• Thermal Property 7%