Journal of Electronic Materials: Foreword

Sung K. Kang; Iver Anderson; Srini Chada; Jeng Gong Duh; Laura J. Turbini; Albert Wu; C. Robert Kao; Fay Hua; K. N. Subramanian; Darrel Frear; Carol Handwerker; Fu Guo; Nik Chawla; Kejun Zeng

doi:10.1007/s11664-009-0939-4

Journal of Electronic Materials: Foreword

Sung K. Kang, Iver Anderson, Srini Chada, Jeng Gong Duh, Laura J. Turbini, Albert Wu, C. Robert Kao, Fay Hua, K. N. Subramanian, Darrel Frear, Carol Handwerker, Fu Guo, Nik Chawla, Kejun Zeng

化學工程與材料工程學系

研究成果: 雜誌貢獻 › 編者言

2 引文斯高帕斯（Scopus）

原文	???core.languages.en_GB???
頁（從 - 到）	2427-2428
頁數	2
期刊	Journal of Electronic Materials
卷	38
發行號	12
DOIs	https://doi.org/10.1007/s11664-009-0939-4
出版狀態	已出版 - 12月 2009

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10.1007/s11664-009-0939-4

引用此

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AU - Kang, Sung K.

AU - Anderson, Iver

AU - Chada, Srini

AU - Duh, Jeng Gong

AU - Turbini, Laura J.

AU - Wu, Albert

AU - Kao, C. Robert

AU - Hua, Fay

AU - Subramanian, K. N.

AU - Frear, Darrel

AU - Handwerker, Carol

AU - Guo, Fu

AU - Chawla, Nik

AU - Zeng, Kejun

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M3 - 編者言

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SN - 0361-5235

VL - 38

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EP - 2428

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 12

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