Is 3D integration an opportunity or just a hype?

Jin Fu Li, Cheng Wen Wu

研究成果: 書貢獻/報告類型會議論文篇章同行評審

29 引文 斯高帕斯(Scopus)

摘要

Three-dimensional (3D) integration using through silicon via (TSV) is an emerging technology for integrated circuit designs. 3D integration technology provides numerous opportunities to designers looking for more cost-effective system chip solutions. In addition to stacking homogeneous memory dies, 3D integration technology supports heterogeneous integration of memories, logic, sensors, etc. It eases the interconnect performance limitation, provides higher functionality, results in small form factor, etc. On the other hand, there are challenges that should be overcome before volume production of TSV-based 3D ICs becomes possible, e.g., technological challenges, yield and test challenges, thermal and power challenges, infrastructure challenges, etc.

原文???core.languages.en_GB???
主出版物標題2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010
頁面541-543
頁數3
DOIs
出版狀態已出版 - 2010
事件2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010 - Taipei, Taiwan
持續時間: 18 1月 201021 1月 2010

出版系列

名字Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

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???event.eventtypes.event.conference???2010 15th Asia and South Pacific Design Automation Conference, ASP-DAC 2010
國家/地區Taiwan
城市Taipei
期間18/01/1021/01/10

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