Intra-channel reconfigurable interface for TSV and micro bump fault tolerance in 3-d RAMs

Kuan Te Wu, Jin Fu Li, Yun Chao Yu, Chih Sheng Hou, Chi Chun Yang, Ding Ming Kwai, Yung Fa Chou, Chih Yen Lo

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

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Engineering & Materials Science