Interfacial Stability in Bi2Te3Thermoelectric Joints

Chun Hsien Wang, Hsien Chien Hsieh, Zhen Wei Sun, V. K. Ranganayakulu, Tian Wey Lan, Yang Yuan Chen, Ying Yi Chang, Albert T. Wu

研究成果: 雜誌貢獻期刊論文同行評審

12 引文 斯高帕斯(Scopus)

摘要

Bismuth telluride (Bi2Te3)-based thermoelectric materials are well-known for their high figure-of-merit (zT value) in the low-temperature region. Stable joints in the module are essential for creating a reliable device for long-term applications. This study used electroless Co-P to prevent a severe interfacial reaction between the joints of solder and Bi2Te3. A thick and brittle SnTe intermetallic compound layer was successfully inhibited. The strength of the joints improved, and the fracture mode became more ductile; furthermore, there was no significant degradation of thermoelectric properties after depositing the Co-P layer after long-term aging. The result suggests that electroless Co-P could enhance the interfacial stability of the joints and be an effective diffusion barrier for Bi2Te3 thermoelectric modules.

原文???core.languages.en_GB???
頁(從 - 到)27001-27009
頁數9
期刊ACS Applied Materials and Interfaces
12
發行號24
DOIs
出版狀態已出版 - 17 6月 2020

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