Inter-firm collaboration for transaction of silicon intellectual property in IC design service industry

Yea Huey Su, Chia Liang Hung, Li Ping Cheng

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

With the advances in semiconductor process technology and the trend of "system on a chip" or "system in package," silicon intellectual property (IP), which is a reusable IC design component, has become an important approach for 1C design. Since most IP providers have different IP technology and core competences, more and more IP providers start to collaborate with one another in order to obtain complementary resources or abilities to provide complete IC design solutions to customers. However, the academic understanding of this issue is still a puzzle. This research then intends to answer the research question: Why does the inter-firm collaboration, a special type of networks, mostly occur for the transaction of silicon intellectual property in the semiconductor industry? By exploring five typical cases, we find that the most common inter-firm collaboration models and difficulties of collaboration between the design service providers and other types of third-party IP providers with different business models. Transaction cost theory is then imported to interpret why the collaboration will mostly occur and how to solve the difficulties during the collaboration process.

原文???core.languages.en_GB???
主出版物標題IEMC 2005
主出版物子標題2005 IEEE International Engineering Management Conference, Proceedings
頁面902-906
頁數5
DOIs
出版狀態已出版 - 2005
事件IEMC 2005: 2005 IEEE International Engineering Management Conference - St. John's, Newfoundland, Canada
持續時間: 11 9月 200513 9月 2005

出版系列

名字IEEE International Engineering Management Conference
II

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???event.eventtypes.event.conference???IEMC 2005: 2005 IEEE International Engineering Management Conference
國家/地區Canada
城市St. John's, Newfoundland
期間11/09/0513/09/05

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