Wafer test integrates innovative works from upstream, automatic test equipment (ATE); middle stream, 2.3D/2.5D; and downstream, statistical analysis of randomness on wafer pattern recognition. NXP Taiwan proposes an AI-driven yield prediction of ATE to reduce test cost during frequent modification and changes in test systems. SiPlus proposes competitive 2.3D and SiPlus eHDF to compare many metrics with 2.5D interposer technology. Powertech Technology Inc. focuses the statistical analysis of randomness on conventional spatial wafer defect patterns. This session addresses an integrated innovation along test systems in ATE in upstream, then 2.3D/SiPlus eHDF integration structure design, finally novel randomness effects on wafer defect diagnosis.