Increasing more bonding energy in nitrogen plasma-activated wafer bonding by HF-Dip

F. S. Lo, C. C. Chiang, C. Li, T. H. Lee

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

2 引文 斯高帕斯（Scopus）

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Engineering & Materials Science

Chemical Compounds