Increasing more bonding energy in nitrogen plasma-activated wafer bonding by HF-Dip

F. S. Lo, C. C. Chiang, C. Li, T. H. Lee

研究成果: 雜誌貢獻期刊論文同行評審

3 引文 斯高帕斯(Scopus)

指紋

深入研究「Increasing more bonding energy in nitrogen plasma-activated wafer bonding by HF-Dip」主題。共同形成了獨特的指紋。

Keyphrases

Engineering