摘要
We demonstrate that Ti/Al/Cr/Mo/Au ohmic contact has an extremely smooth surface morphology of 29.0 nm and a low specific contact resistivity (pc) of 1.1×10 -6 ohm-cm 2 on n-type AlGaN/GaN heterostructures. The use of Cr interlayer in Ti/Al/Cr/Mo/Au contacts leads to significantly improved contact morphology without any degradation on the contact resistance. This is attributed to the reduced inter-diffusion and reaction between the layers in the contact stack.
原文 | ???core.languages.en_GB??? |
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文章編號 | 72162P |
期刊 | Proceedings of SPIE - The International Society for Optical Engineering |
卷 | 7216 |
DOIs | |
出版狀態 | 已出版 - 2009 |
事件 | Gallium Nitride Materials and Devices IV - San Jose, CA, United States 持續時間: 26 1月 2009 → 29 1月 2009 |