This paper discusses the integration of an end-to-end optical interconnect testbed on printed circuit boards using inexpensive off-the-shelf, bare die, optoelectronic components. We developed a process for efficient and simultaneous in-plane optical coupling between edge emitting laser and waveguides, and between photodetector and waveguide. We demonstrated an optically smooth buffer layer separating the printed circuit layer from the optical transport layer. The demonstrated radically new optical interconnect technology, which we refer to as interface optical coupling, is able to efficiently and simultaneously form optical interfaces between waveguides, lasers and photodetectors by photolithographic technique, thereby eliminating the need for micro-lenses and manual alignment. The measured laser to waveguide coupling efficiency is 45% and measured waveguide to photodetector coupling is 35%. The optical link is demonstrated to operate at 10 Gbps.
|頁（從 - 到）||708-715|
|期刊||IEEE Transactions on Components and Packaging Technologies|
|出版狀態||已出版 - 12月 2007|