Highly-selective MOCA lowpass filter designs using glass-based TF-IPD technology

Tsaitzu Lee, Yo Shen Lin, Chia Chun Chen

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

In this work, a thin-film integrated passive device (TF-IPD) technology has been developed to meet the requirements of smaller form factor, lower cost, and faster design cycling time in modern RF front-end application. Two very compact and highly-selective TF-IPD lowpass filter designs for the Multimedia over Coax Alliance (MoCA) application are demonstrated. They are required to pass the CATV-band from 50 to 750MHz, and exhibit very good rejection for frequency higher than 975MHz. Specifically, the Design 1 has an in-band insertion loss of 1.8dB with more than 40dB rejection from 975MHz to 5.8GHz. On the other hand, the Design 2 with a different layout method and thus different coupling effect has an excellent in-band insertion loss of 1.4dB and a flat 30 dB stop-band from 1.4 to 4 GHz. It is thus possible to adjust the coupling within the circuit layout to meet different filter specifications. Both designs have chip sizes around 6 mm2, which are much smaller than the conventional designs based on discrete components. The proposed highly-selective lowpass filter designs can also be applied to mobile communication devices due to their compact size and good performance.

原文???core.languages.en_GB???
主出版物標題International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
出版狀態已出版 - 2010
事件2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
持續時間: 20 10月 201022 10月 2010

出版系列

名字International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

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???event.eventtypes.event.conference???2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
國家/地區Taiwan
城市Taipei
期間20/10/1022/10/10

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