High power LED package with vertical structure

Ming Te Lin; Shang Ping Ying; Ming Yao Lin; Kuang Yu Tai; Jyh Chen Chen

doi:10.1016/j.microrel.2011.07.064

High power LED package with vertical structure

Ming Te Lin, Shang Ping Ying, Ming Yao Lin, Kuang Yu Tai, Jyh Chen Chen

機械工程學系

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

18 引文斯高帕斯（Scopus）

摘要

A LED package structure with vertical geometry of W5II is proposed for high power optoelectronic semiconductor devices. To provide an efficient and easy method of assembling high-power LEDs to sockets of the fixtures, a vertical design referenced from the typical Edison screw base found in US-based lamp systems is used in the structure. The thermal simulation of the structure, fabrication processes and thermal characteristic are evaluated. Thermal resistance measurements are performed to characterize the thermal performance of W5II, and the optical and electrical characteristics of W5II are also verified. The good heat dissipation of W5II could be utilized to enhance the reliability and thermal fatigue capability of high-power LED packages.

原文	???core.languages.en_GB???
頁（從 - 到）	878-883
頁數	6
期刊	Microelectronics Reliability
卷	52
發行號	5
DOIs	https://doi.org/10.1016/j.microrel.2011.07.064
出版狀態	已出版 - 5月 2012

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10.1016/j.microrel.2011.07.064

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title = "High power LED package with vertical structure",

abstract = "A LED package structure with vertical geometry of W5II is proposed for high power optoelectronic semiconductor devices. To provide an efficient and easy method of assembling high-power LEDs to sockets of the fixtures, a vertical design referenced from the typical Edison screw base found in US-based lamp systems is used in the structure. The thermal simulation of the structure, fabrication processes and thermal characteristic are evaluated. Thermal resistance measurements are performed to characterize the thermal performance of W5II, and the optical and electrical characteristics of W5II are also verified. The good heat dissipation of W5II could be utilized to enhance the reliability and thermal fatigue capability of high-power LED packages.",

author = "Lin, {Ming Te} and Ying, {Shang Ping} and Lin, {Ming Yao} and Tai, {Kuang Yu} and Chen, {Jyh Chen}",

note = "Funding Information: The authors would like to thank the Ministry of Economic Affairs, R.O.C. for its support of this technology development program for Industrial Technology Research Institute under the project “High Efficiency AC LED Devices Technology”.",

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T1 - High power LED package with vertical structure

AU - Lin, Ming Te

AU - Ying, Shang Ping

AU - Lin, Ming Yao

AU - Tai, Kuang Yu

AU - Chen, Jyh Chen

N1 - Funding Information: The authors would like to thank the Ministry of Economic Affairs, R.O.C. for its support of this technology development program for Industrial Technology Research Institute under the project “High Efficiency AC LED Devices Technology”.

PY - 2012/5

Y1 - 2012/5

N2 - A LED package structure with vertical geometry of W5II is proposed for high power optoelectronic semiconductor devices. To provide an efficient and easy method of assembling high-power LEDs to sockets of the fixtures, a vertical design referenced from the typical Edison screw base found in US-based lamp systems is used in the structure. The thermal simulation of the structure, fabrication processes and thermal characteristic are evaluated. Thermal resistance measurements are performed to characterize the thermal performance of W5II, and the optical and electrical characteristics of W5II are also verified. The good heat dissipation of W5II could be utilized to enhance the reliability and thermal fatigue capability of high-power LED packages.

AB - A LED package structure with vertical geometry of W5II is proposed for high power optoelectronic semiconductor devices. To provide an efficient and easy method of assembling high-power LEDs to sockets of the fixtures, a vertical design referenced from the typical Edison screw base found in US-based lamp systems is used in the structure. The thermal simulation of the structure, fabrication processes and thermal characteristic are evaluated. Thermal resistance measurements are performed to characterize the thermal performance of W5II, and the optical and electrical characteristics of W5II are also verified. The good heat dissipation of W5II could be utilized to enhance the reliability and thermal fatigue capability of high-power LED packages.

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DO - 10.1016/j.microrel.2011.07.064

M3 - 期刊論文

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SN - 0026-2714

VL - 52

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EP - 883

JO - Microelectronics Reliability

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High power LED package with vertical structure

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