High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems

Gee Kung Chang, Daniel Guidotti, Zhaoran Rena Huang, Lixi Wan, Jianjun Yu, Shashikant Hegde, Hung Fei Kuo, Yin Jung Chang, Fuhan Liu, Fentao Wang, Rao Tummala

研究成果: 雜誌貢獻 › 會議論文 › 同行評審

7 引文 斯高帕斯（Scopus）

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