Heat Transfer Performance of Aluminum-Ammonia Heat Pipe at Low Temperature Under Various Heating/Cooling Conditions

Chien Cheng Wang, Chieh Lung, Mu Ting Hsieh, Chien Yuh Yang

研究成果: 書貢獻/報告類型會議論文篇章同行評審

摘要

For understanding the thermal performance of heat pipes at low working temperatures, this study conducted an experimental measurement of heat transfer performance of grooved aluminum-ammonia heat pipes at condensing temperature from -10 to -40°C. The test results showed that the effect of condensing temperature on thermal resistances was not significant while the heat pipe dried out earlier at the lowest condensing temperature (-40°C) condition. The heating surface did not affect the thermal resistance obviously. However, the thermal resistance under 2-side cooling was just about half of that under I-side cooling.

原文???core.languages.en_GB???
主出版物標題2024 International Conference on Electronics Packaging, ICEP 2024
發行者Institute of Electrical and Electronics Engineers Inc.
頁面253-254
頁數2
ISBN(電子)9784991191176
DOIs
出版狀態已出版 - 2024
事件23rd International Conference on Electronics Packaging, ICEP 2024 - Toyama, Japan
持續時間: 17 4月 202420 4月 2024

出版系列

名字2024 International Conference on Electronics Packaging, ICEP 2024

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???event.eventtypes.event.conference???23rd International Conference on Electronics Packaging, ICEP 2024
國家/地區Japan
城市Toyama
期間17/04/2420/04/24

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