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Fabrication of new composite abrasive for jet machining and application to scrap wafer regeneration
J. H. Ke, F. C. Tsai,
J. C. Hung
, T. Y. Yang,
B. H. Yan
機械工程學系
研究成果
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雜誌貢獻
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期刊論文
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Keyphrases
Wafer
100%
Regeneration
100%
New Composite Materials
100%
Jet Machining
100%
Composite Abrasive
100%
Scrap
100%
Surface Roughness
50%
Abrasive Jet Machining
33%
Silicon Wafer
16%
Polystyrene
16%
Abrasive
16%
SiC Particle Size
16%
SiC Particles
16%
Novel Composite
16%
Polymer Surface
16%
Processing Time
16%
Micromachining
16%
Direct Impact
16%
Thermoplastic Polymer
16%
Hard Brittle Material
16%
Coating Temperature
16%
Small Crack
16%
Shallow Crack
16%
Machining Properties
16%
Engineering
Abrasive
100%
Abrasive Jet
100%
Silicon Wafer
50%
Size of Particle
50%
Processing Time
50%
Micro Machining
50%
Polymer Surface
50%
Base Material
50%
Brittleness
50%
Material Science
Machining
100%
Composite Material
100%
Surface Roughness
50%
Abrasive Jet Machining
33%
Surface (Surface Science)
33%
Abrasive
33%
Silicon Wafer
16%
Polystyrene
16%
Thermoplastics
16%
Brittleness
16%