Fabrication of micrometer Ni columns by continuous and intermittent microanode guided electroplating

J. C. Lin, S. B. Jang, D. L. Lee, C. C. Chen, P. C. Yeh, T. K. Chang, J. H. Yang

研究成果: 雜誌貢獻期刊論文同行評審

34 引文 斯高帕斯(Scopus)

摘要

Micrometer nickel columns were fabricated by a novel process called microanode guided electroplating (MAGE). In the MAGE process, a microanode of platinum (125 νm in diameter) was controlled to move in either continuous or intermittent mode to guide the progress of Ni-electroplating. The microfabrication was guided from the location of a copper substrate that is initially in contact with the microanode to develop a micrometer column and its appearance was determined by the motion mode (i.e., continuous or intermittent) of the microanode. The intermittent MAGE was superior to the continuous one for fabricating micrometer nickel columns with fine surface morphology and uniform diameter. Different models are proposed and they are simulated by the commercial software ANSYS 8.0 to understand the quantitative distribution in the process of MAGE.

原文???core.languages.en_GB???
頁(從 - 到)2405-2413
頁數9
期刊Journal of Micromechanics and Microengineering
15
發行號12
DOIs
出版狀態已出版 - 1 12月 2005

指紋

深入研究「Fabrication of micrometer Ni columns by continuous and intermittent microanode guided electroplating」主題。共同形成了獨特的指紋。

引用此