Fabrication of Mg-based intermetallic compounds by liquid electromigration

C. H. Li, Y. C. Chuang, C. Y. Liu

研究成果: 雜誌貢獻期刊論文同行評審

2 引文 斯高帕斯(Scopus)

摘要

In this study, we successfully produced the compound phase Mg 2Ni by using the liquid electromigration (EM) method. The application of a high-density current flow through the Ni/molten Mg/Ni sandwich structure caused the Ni atoms in the molten Mg to electromigrate toward the anode interface to form a thick layer of compound Mg 2Ni at the anode's molten Mg/Ni interface. The formation of the interfacial Mg 2Ni compound was much larger than that which occurs in the no-current case. This implies that the growth of the interfacial Mg 2Ni compound can be enhanced by current stressing. Remarkably, as can be seen from the X-ray diffraction (XRD) analysis, the EM-grown Mg 2Ni phase is shown to be indicative of texture in nature, that is, only one single peak [(110) plane] appears in the XRD diffraction pattern. This observation suggests that the formation of EM-grown Mg 2Ni compound at the anode interface closely corresponds to the direction of electron flow.

原文???core.languages.en_GB???
頁(從 - 到)1489-1494
頁數6
期刊Journal of Electronic Materials
36
發行號11
DOIs
出版狀態已出版 - 11月 2007

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