Fabrication of an electro-thermal micro gripper using silver-nickel ink

Yao Yun Feng; Shih Jui Chen; Ping Hsun Hsieh

doi:10.1109/MEMSYS.2016.7421837

Fabrication of an electro-thermal micro gripper using silver-nickel ink

Yao Yun Feng, Shih Jui Chen, Ping Hsun Hsieh

機械工程學系

研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審

4 引文斯高帕斯（Scopus）

摘要

This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.

原文	???core.languages.en_GB???
主出版物標題	MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
發行者	Institute of Electrical and Electronics Engineers Inc.
頁面	1141-1144
頁數	4
ISBN（電子）	9781509019731
DOIs	https://doi.org/10.1109/MEMSYS.2016.7421837
出版狀態	已出版 - 26 2月 2016
事件	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 - Shanghai, China 持續時間: 24 1月 2016 → 28 1月 2016

出版系列

名字	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
卷	2016-February
ISSN（列印）	1084-6999

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???	29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
國家/地區	China
城市	Shanghai
期間	24/01/16 → 28/01/16

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10.1109/MEMSYS.2016.7421837

三維微型電磁能源擷取系統開發II(1/2)
Chen, S.-J. (PI)
1/08/15 → 31/07/16
研究計畫: Research

引用此

Feng, Y. Y., Chen, S. J., & Hsieh, P. H. (2016). Fabrication of an electro-thermal micro gripper using silver-nickel ink. 於 MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems (頁 1141-1144). 文章 7421837 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2016-February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2016.7421837

Feng, Yao Yun ; Chen, Shih Jui ; Hsieh, Ping Hsun. / Fabrication of an electro-thermal micro gripper using silver-nickel ink. MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2016. 頁 1141-1144 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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title = "Fabrication of an electro-thermal micro gripper using silver-nickel ink",

abstract = "This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.",

author = "Feng, {Yao Yun} and Chen, {Shih Jui} and Hsieh, {Ping Hsun}",

note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016 ; Conference date: 24-01-2016 Through 28-01-2016",

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Feng, YY, Chen, SJ & Hsieh, PH 2016, Fabrication of an electro-thermal micro gripper using silver-nickel ink. 於 MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems., 7421837, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 卷 2016-February, Institute of Electrical and Electronics Engineers Inc., 頁 1141-1144, 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016, Shanghai, China, 24/01/16. https://doi.org/10.1109/MEMSYS.2016.7421837

Fabrication of an electro-thermal micro gripper using silver-nickel ink. / Feng, Yao Yun; Chen, Shih Jui; Hsieh, Ping Hsun.
MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc., 2016. p. 1141-1144 7421837 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); 卷 2016-February).

研究成果: 書貢獻/報告類型 › 會議論文篇章 › 同行評審

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T1 - Fabrication of an electro-thermal micro gripper using silver-nickel ink

AU - Feng, Yao Yun

AU - Chen, Shih Jui

AU - Hsieh, Ping Hsun

PY - 2016/2/26

Y1 - 2016/2/26

N2 - This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.

AB - This paper reports a miniaturized electro-thermal gripper with a novel fabrication process applying composite silver-nickel ink. Compared to state of the art, a thick resistive structure is dispensed on a silicon wafer by an injecting machine, which will decrease the fabrication process complexity. Device size, driving power and deformation of the gripper could be further improved by stacking multi-layers of silver-nickel structures. In the paper, the electrical and mechanical behaviors of the micro-grippers are well characterized. The displacement of each arm is observed to be 310.6 μm for the applied current of 0.26 A. The maximum power dissipation is 400 mW for the actuators. The fabricated micro gripper can grip a small ball with a diameter of 1.3 mm.

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PB - Institute of Electrical and Electronics Engineers Inc.

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Feng YY, Chen SJ, Hsieh PH. Fabrication of an electro-thermal micro gripper using silver-nickel ink. 於 MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems. Institute of Electrical and Electronics Engineers Inc. 2016. p. 1141-1144. 7421837. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2016.7421837

Fabrication of an electro-thermal micro gripper using silver-nickel ink

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三維微型電磁能源擷取系統開發II(1/2)

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