Exploratory study on emerging integrator business model in engineering chain of the semiconductor industry: Re-integration of vertical disintegration

Yea Husy Su, Ruey Shan Guo, Chia Wen Lo, Dain Xuan Kao

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

This study attempts to explore the possible new business model in the engineering chain of the semiconductor industry to overcome the challenges of the trend of re-integration of vertical disintegration due to higher design complexity in the nano-CMOS generation. We propose one better alternative that a foundry separates its company into capital/technology intensive section and service integration section. The service integration section can be spin-off from a foundry to run the integrator business model.

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主出版物標題2008 International Symposium on Semiconductor Manufacturing, ISSM 2008
頁面37-39
頁數3
出版狀態已出版 - 2008
事件2008 17th International Symposium on Semiconductor Manufacturing, ISSM 2008 - Tokyo, Japan
持續時間: 27 10月 200829 10月 2008

出版系列

名字IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
ISSN(列印)1523-553X

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???event.eventtypes.event.conference???2008 17th International Symposium on Semiconductor Manufacturing, ISSM 2008
國家/地區Japan
城市Tokyo
期間27/10/0829/10/08

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