@inproceedings{9fd833c0f75b418ea66c3a4703f37e57,
title = "Experimental results of a wafer positioning system using machine vision after system calibration",
abstract = "This article proposed calibration results of a real-time wafer positioning system using machine vision. We developed a novel wafer positioning system which comprises two line-shaped beams spreading toward a scattering surface on the way of wafer transfer. A CCD (charge coupled device) camera mounted above the scattering surface takes images, and these images are processed and analyzed to compute the actual position of the wafer center on the blade during the transfer process. A calibration process and linear fitting of the wafer center are proposed to compensate the system errors induced from manufacturing and assembly. Experimental results illustrate that the precision and accuracy of this wafer positioning system have been both improved after calibrating the system errors.",
keywords = "CCD camera, Image Processing, Wafer Positioning",
author = "Chen, {Yi Cheng} and Chen, {Yu Pin} and Lee, {Ju Yi}",
year = "2012",
language = "???core.languages.en_GB???",
isbn = "9781467322591",
series = "Proceedings of the SICE Annual Conference",
publisher = "Society of Instrument and Control Engineers (SICE)",
pages = "1014--1017",
booktitle = "2012 Proceedings of SICE Annual Conference, SICE 2012",
note = "2012 51st Annual Conference on of the Society of Instrument and Control Engineers of Japan, SICE 2012 ; Conference date: 20-08-2012 Through 23-08-2012",
}