Experimental results of a wafer positioning system using machine vision after system calibration

Yi Cheng Chen, Yu Pin Chen, Ju Yi Lee

研究成果: 書貢獻/報告類型會議論文篇章同行評審

6 引文 斯高帕斯(Scopus)

摘要

This article proposed calibration results of a real-time wafer positioning system using machine vision. We developed a novel wafer positioning system which comprises two line-shaped beams spreading toward a scattering surface on the way of wafer transfer. A CCD (charge coupled device) camera mounted above the scattering surface takes images, and these images are processed and analyzed to compute the actual position of the wafer center on the blade during the transfer process. A calibration process and linear fitting of the wafer center are proposed to compensate the system errors induced from manufacturing and assembly. Experimental results illustrate that the precision and accuracy of this wafer positioning system have been both improved after calibrating the system errors.

原文???core.languages.en_GB???
主出版物標題2012 Proceedings of SICE Annual Conference, SICE 2012
發行者Society of Instrument and Control Engineers (SICE)
頁面1014-1017
頁數4
ISBN(列印)9781467322591
出版狀態已出版 - 2012
事件2012 51st Annual Conference on of the Society of Instrument and Control Engineers of Japan, SICE 2012 - Akita, Japan
持續時間: 20 8月 201223 8月 2012

出版系列

名字Proceedings of the SICE Annual Conference

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???event.eventtypes.event.conference???2012 51st Annual Conference on of the Society of Instrument and Control Engineers of Japan, SICE 2012
國家/地區Japan
城市Akita
期間20/08/1223/08/12

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