Evolutionary engineering collaboration for DFM/DFY solutions between foundry and EDA tool vendor

Yea Huey Su, Ruey Shan Guo, Hsiao Huan Chang

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

With the migration to deep-submicron technology, foundries face even more challenges than ever to help their customers to develop IC for time-to-market. The goal of this research is then to explore how foundries and EDA tool vendors collaborate with each other for DFM/DFY solutions. By conducting field interviews and empirical study on two leading foundaries and three EDA tool vendors, this research summarizes four aspects of collaboration activities, which are design problem, design scope, released information, and collaboration mechanism, under three different collaboration stages. Results of the study show that in the era of DFM, both parties have expanded their collaboration activities, from post-design manufacturing stage to all stages of design. In addition, the collaboration pattern has transformed from input-output coordination to know-how sharing and then to know-how creation in 90nm technology. The study concludes that as design automation and process technology become more advanced, the value of reference flow becomes higher.

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主出版物標題ISSM 2006 Conference Proceedings - Fifteenth International Symposium on Semiconductor Manufacturing
頁面475-478
頁數4
DOIs
出版狀態已出版 - 2006
事件ISSM 2006 - 15th International Symposium on Semiconductor Manufacturing - Tokyo, Japan
持續時間: 25 9月 200727 9月 2007

出版系列

名字IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings
ISSN(列印)1523-553X

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???event.eventtypes.event.conference???ISSM 2006 - 15th International Symposium on Semiconductor Manufacturing
國家/地區Japan
城市Tokyo
期間25/09/0727/09/07

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