Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications

搜尋結果

• 已完成

  類表面電漿之時-空間色散工程於高頻雷達系統之整合應用(1/2)

  Ou Yang, L.-Y. (PI)

  1/08/21 → 31/07/22

  研究計畫: Research

  • Mutual Coupling 100%
  • Packaging Applications 100%
  • Equivalent Circuit Extraction 100%
  • Effective Isotropic Radiated Power 100%
  • Power Optimization 100%