Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications

Keyphrases

• Packaging Applications 100%
• Solder Bump 100%
• Millimeter-wave Package 100%
• Equivalent Circuit Extraction 100%
• Package Structure 66%
• On chip 33%
• Millimeter Wave 33%
• Signaling Pathway 33%
• Wireless Communication 33%
• Structure Effect 33%
• Fifth Generation 33%
• Bump 33%
• Operating Frequency 33%
• Electrical Signal 33%
• Electrical Length 33%
• Parasitic Effects 33%
• Chip Packaging 33%
• Chip Performance 33%
• Flip chip Structure 33%
• Packaging Effect 33%
• Equivalent Lumped Circuit 33%

Engineering

• Equivalent Circuit 100%
• Millimeter Wave 100%
• Solder Bump 100%
• Operating Frequency 33%
• Wireless Communication 33%
• Signal Path 33%
• Electrical Signal 33%