Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications

Liang Yu Ou Yang, Chia Hung Kao

研究成果: 書貢獻/報告類型會議論文篇章同行評審

指紋

深入研究「Equivalent Circuit Extraction of Solder Bumps Using a Single Calibration Component for Millimeter-Wave Packaging Applications」主題。共同形成了獨特的指紋。

Engineering & Materials Science