@inproceedings{f63002a96d3644dbbdab7c8e8dd7abde,
title = "Enhancement of Bandwidth-Responsivity Product in High-Speed Avalanche Photodiodes with Optimized Flip-Chip Bonding Package for Coherent Detection",
abstract = "Flip-chip bonding APDs with 14μm window diameters are demonstrated. Wide-bandwidth (36GHz), high-responsivity (3.4A/W), low dark current (175nA) and high MMW output power (-1dBm at 40GHz) can be achieved simultaneously with 12.5mA Isat under 0.9Vbr.",
author = "Naseem and Chen, {Nan Wei} and Parvez, {Syed Hasan} and Zohauddin Ahmad and Sean Yang and Chen, {H. S.} and Chang, {Hsiang Szu} and Huang, {Jack Jia Sheng} and Shi, {Jin Wei}",
note = "Publisher Copyright: {\textcopyright} 2023 The Author(s).; 2023 Optical Fiber Communications Conference and Exhibition, OFC 2023 ; Conference date: 05-05-2023 Through 09-05-2023",
year = "2023",
doi = "10.23919/OFC49934.2023.10116642",
language = "???core.languages.en_GB???",
series = "2023 Optical Fiber Communications Conference and Exhibition, OFC 2023 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 Optical Fiber Communications Conference and Exhibition, OFC 2023 - Proceedings",
}