跳至主導覽 跳至搜尋 跳過主要內容

Enhanced Performance of P-FeFETs with TiN:2.5nm/Mo/TiN Gate Stacks for 3-bit-per-cell Operation, 3.5V Read-after-Write, and High Endurance (109 Cycles) in Compute-in-Memory Applications

  • C. Y. Tsai
  • , M. H. Hsiung
  • , Y. C. Chen
  • , Y. T. Tsai
  • , Y. T. Tang

研究成果: 書貢獻/報告類型會議論文篇章同行評審

摘要

This study examines the performance of P-type FeFETs with various gate stacks, focusing on the TiN:2.5nm/Mo/TiN electrode. XPS and interface trap density (Dits) analyses confirm that ultra-thin barrier of TiN (b-TiN) suppresses Mo oxidation and carrier trapping in HZO, enhancing the memory window and reducing Vth variability. The sandwiched structure improves write speed, switching time, and low-voltage read-after-write operations. In neural network applications, b-TiN/Mo/TiN ensures more linear conductance and faster accuracy convergence, driving computational efficiency for CIM technologies. This work addresses the potential of b-TiN/Mo/TiN in enhancing FeFET reliability, endurance, and performance for neuromorphic and CIM applications.

原文???core.languages.en_GB???
主出版物標題9th IEEE Electron Devices Technology and Manufacturing Conference
主出版物子標題Shaping the Future with Innovations in Devices and Manufacturing, EDTM 2025
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9798331504168
DOIs
出版狀態已出版 - 2025
事件9th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2025 - Hong Kong, Hong Kong
持續時間: 9 3月 202512 3月 2025

出版系列

名字9th IEEE Electron Devices Technology and Manufacturing Conference: Shaping the Future with Innovations in Devices and Manufacturing, EDTM 2025

???event.eventtypes.event.conference???

???event.eventtypes.event.conference???9th IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2025
國家/地區Hong Kong
城市Hong Kong
期間9/03/2512/03/25

指紋

深入研究「Enhanced Performance of P-FeFETs with TiN:2.5nm/Mo/TiN Gate Stacks for 3-bit-per-cell Operation, 3.5V Read-after-Write, and High Endurance (109 Cycles) in Compute-in-Memory Applications」主題。共同形成了獨特的指紋。

引用此