摘要
Enhanced growth of low-resistivity self-aligned titanium silicides on epitaxial Si0.7Ge0.3 with a sacrificial amorphous Si (a-Si) interlayer has been achieved. The a-Si layer with appropriate thickness was found to prevent Ge segregation, decrease the growth temperature, as well as maintain the interface flatness and morphological stability in forming low-resistivity C54-TiSi2 on Si0.7Ge0.3 grown by molecular beam epitaxy. The process promises to be applicable to the fabrication of high-speed Si-Ge devices.
| 原文 | ???core.languages.en_GB??? |
|---|---|
| 頁(從 - 到) | 7279-7282 |
| 頁數 | 4 |
| 期刊 | Thin Solid Films |
| 卷 | 518 |
| 發行號 | 24 |
| DOIs | |
| 出版狀態 | 已出版 - 1 10月 2010 |
指紋
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