摘要
Enhanced growth of low-resistivity NiSi on epitaxial Si0.7Ge0.3 with a sacrificial amorphous Si interlayer was achieved. The selection of the thickness ratio of Ni and a-Si was such that the a-Si was completely consumed in forming NiSi. The a-Si layer with appropriate thickness was found to prevent Ge segregation, decrease the growth temperature, as well as maintain the interface flatness and morphological stability in forming low-resistivity NiSi on epitaxial Si0.7Ge0.3 grown by molecular beam epitaxy.
| 原文 | ???core.languages.en_GB??? |
|---|---|
| 頁(從 - 到) | 2147-2150 |
| 頁數 | 4 |
| 期刊 | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures |
| 卷 | 21 |
| 發行號 | 5 |
| 出版狀態 | 已出版 - 9月 2003 |
指紋
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