Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization

C. Y. Liu, K. N. Tu, T. T. Sheng, C. H. Tung, D. R. Frear, P. Elenius

研究成果: 雜誌貢獻期刊論文同行評審

120 引文 斯高帕斯(Scopus)

摘要

The wetting reaction between molten eutectic SnPb solder and a sputtered trilayer Cu/Ni(V)/Al thin film metallization was studied using cross-sectional transmission electron microscopy and scanning electron microscopy. Reaction temperatures were from 200 to 240°C and reaction times ranged from 1 to 40 min. The initial reaction products were Cu6Sn5 and Cu3Sn. The latter transforms to the former after an annealing greater than 1 min at 220°C. The Cu6Sn5 grains adhere well to the Ni(V) surface and no spalling of them was observed, even after 40 min at 220°C. This surprising result indicates that the Cu/Ni(V)/Al or Cu6Sn5 /Ni(V)/Al is a stable thin film metallization for low temperature eutectic SnPb solder direct chip attachment to organic substrates. Additionally, Kirkendall voids accompanied Cu3Sn formation, yet the voids disappear when the Cu3Sn transforms to Cu6Sn5.

原文???core.languages.en_GB???
頁(從 - 到)750-754
頁數5
期刊Journal of Applied Physics
87
發行號2
DOIs
出版狀態已出版 - 15 1月 2000

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