Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes

C. C. Wei, Cheng Yi Liu

研究成果: 雜誌貢獻期刊論文同行評審

13 引文 斯高帕斯(Scopus)

摘要

Using Blech's structure, we studied the electromigration (EM) behaviors of four different Sn(Cu) and Sn(Ni) alloys, which are Sn, Sn0.7Cu, Sn3.0Cu, and Sn1Ni. The order of the EM rates was determined to be Sn0.7Cu > Sn > Sn3Cu > Sn1Ni. We believe that the lower yielding strength and higher grain boundary density of Sn0.7Cu were the main reasons that Sn0.7Cu had the fastest EM rate. Moreover, we found that the addition at Ni could effectively retard EM. The critical products of Sn, Sn0.7Cu, and Sn3.0Cu, which were determined to be 1500, 500, and 1580 A/cm, respectively. The diffuse-effective charge (DZ*) values of the solder stripes from this present work have same order magnitude of the reported values, which were measured by using actual solder bumps.

原文???core.languages.en_GB???
頁(從 - 到)2072-2079
頁數8
期刊Journal of Materials Research
20
發行號8
DOIs
出版狀態已出版 - 8月 2005

指紋

深入研究「Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes」主題。共同形成了獨特的指紋。

引用此