TY - JOUR
T1 - Electromigration studies of Sn(Cu) and Sn(Ni) alloy stripes
AU - Wei, C. C.
AU - Liu, Cheng Yi
N1 - Funding Information:
The authors would like to thank the National Science Council of Taiwan and the MOE Program for Promoting Academic Excellence of Universities under Grant No. 91-E-FA06-1-4 for support of this project. Also, financial support from Intel, Santa Clara, CA, and helpful discussion from Dr. Fay Hua are gratefully acknowledged.
PY - 2005/8
Y1 - 2005/8
N2 - Using Blech's structure, we studied the electromigration (EM) behaviors of four different Sn(Cu) and Sn(Ni) alloys, which are Sn, Sn0.7Cu, Sn3.0Cu, and Sn1Ni. The order of the EM rates was determined to be Sn0.7Cu > Sn > Sn3Cu > Sn1Ni. We believe that the lower yielding strength and higher grain boundary density of Sn0.7Cu were the main reasons that Sn0.7Cu had the fastest EM rate. Moreover, we found that the addition at Ni could effectively retard EM. The critical products of Sn, Sn0.7Cu, and Sn3.0Cu, which were determined to be 1500, 500, and 1580 A/cm, respectively. The diffuse-effective charge (DZ*) values of the solder stripes from this present work have same order magnitude of the reported values, which were measured by using actual solder bumps.
AB - Using Blech's structure, we studied the electromigration (EM) behaviors of four different Sn(Cu) and Sn(Ni) alloys, which are Sn, Sn0.7Cu, Sn3.0Cu, and Sn1Ni. The order of the EM rates was determined to be Sn0.7Cu > Sn > Sn3Cu > Sn1Ni. We believe that the lower yielding strength and higher grain boundary density of Sn0.7Cu were the main reasons that Sn0.7Cu had the fastest EM rate. Moreover, we found that the addition at Ni could effectively retard EM. The critical products of Sn, Sn0.7Cu, and Sn3.0Cu, which were determined to be 1500, 500, and 1580 A/cm, respectively. The diffuse-effective charge (DZ*) values of the solder stripes from this present work have same order magnitude of the reported values, which were measured by using actual solder bumps.
UR - http://www.scopus.com/inward/record.url?scp=28844483497&partnerID=8YFLogxK
U2 - 10.1557/JMR.2005.0257
DO - 10.1557/JMR.2005.0257
M3 - 期刊論文
AN - SCOPUS:28844483497
SN - 0884-2914
VL - 20
SP - 2072
EP - 2079
JO - Journal of Materials Research
JF - Journal of Materials Research
IS - 8
ER -