Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces

H. W. Tseng, C. T. Lu, Y. H. Hsiao, P. L. Liao, Y. C. Chuang, T. Y. Chung, C. Y. Liu

研究成果: 雜誌貢獻期刊論文同行評審

34 引文 斯高帕斯(Scopus)

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Physics & Astronomy

Engineering & Materials Science

Chemical Compounds