Electromigration failures at Cu/Sn joint interface

Keyphrases

• Cu-Sn 100%
• Electromigration 100%
• Joint Interface 100%
• Anode Interface 66%
• Current Density 33%
• Failure Mode 33%
• Flip chip 33%
• Cu Pad 33%
• High Current Density 33%
• Induced Failures 33%
• Current Stressing 33%
• Cathode Interface 33%
• Reliability Issues 33%
• Cu3Sn 33%
• Maximum Current Density 33%
• Kirkendall Voids 33%
• Minimum Current 33%

Engineering

• Electromigration 100%
• Joint Interface 100%
• High Current Density 33%
• Failure Mode 33%
• Reliability Issue 33%
• Induced Failure 33%
• Corner Joint 33%

Material Science

• Density 100%
• Anode 50%
• Cathode 25%