Electroless Co-P diffusion barrier for n-PbTe thermoelectric material

Hsien Chien Hsieh, Chun Hsien Wang, Wen Chih Lin, Subhendu Chakroborty, Tse Hsiao Lee, Hsu Shen Chu, Albert T. Wu

研究成果: 雜誌貢獻期刊論文同行評審

30 引文 斯高帕斯(Scopus)

摘要

This work describes an in-depth study on the electroless deposition of Co–P via the addition of a reductant to a solution on a roughened, sensitized, and activated n-PbTe thermoelectric substrate. The Co–P layer facilitates the bonding of the thermoelectric module with the solder paste and serves as a diffusion barrier that prevents severe interaction between n-PbTe and Cu or Ni electrodes. Without this layer, a eutectic reaction produces molten PbTe because of the fast diffusion of Cu; moreover, a large Cu2Te phase is formed, resulting in the depletion of Cu from the Cu electrode. In addition, Pb and Te diffuse along the grain boundaries of the Ni electrode in the Ni/n-PbTe joint. Cross-sectional images and elemental analysis results show that the Co–P layer could efficiently inhibit interdiffusion in the Ni/n-PbTe and Cu/n-PbTe joints. These results provide new insights for developing PbTe thermoelectric devices using Ni or Cu electrodes with high reliability at working temperatures.

原文???core.languages.en_GB???
頁(從 - 到)1023-1029
頁數7
期刊Journal of Alloys and Compounds
728
DOIs
出版狀態已出版 - 2017

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