Electrodeposition of copper on a Pt(111) electrode in sulfuric acid containing poly(ethylene glycol) and chloride ions as probed by in situ STM

Chemical Compounds

• Tunneling Current 100%
• Sulfuric Acid 56%
• Electrodeposition 54%
• Nucleation 53%
• Poly(ethylene Glycol) 52%
• Underpotential Deposition 43%
• Adatoms 39%
• Deposition Process 35%
• Behavior as Electrode 32%
• Monolayer 24%
• Voltage 23%
• Molecule 22%
• Additive 21%
• Molecular Cluster 21%
• Surface 20%
• Anion 19%
• Chloride 19%
• Weight 17%
• Adsorption 15%

Engineering & Materials Science

• Polyethylene glycols 84%
• Electrodeposition 83%
• Sulfuric acid 81%
• Ions 59%
• Copper 52%
• Electrodes 49%
• Nucleation 17%
• Molecules 15%
• Adatoms 15%
• Nanoclusters 14%
• Potassium chloride 11%
• Negative ions 10%
• Monolayers 10%
• Bias voltage 10%
• Molecular weight 9%
• Adsorption 7%
• Imaging techniques 6%
• Defects 5%

Physics & Astronomy

• sulfuric acid 83%
• glycols 69%
• electrodeposition 67%
• chlorides 65%
• ethylene 63%
• copper 46%
• electrodes 40%
• ions 30%
• nucleation 12%
• bypasses 10%
• nanoclusters 8%
• molecules 8%
• adatoms 8%
• molecular weight 7%
• anions 7%
• adsorption 6%