Electrical current induced local thermal stress caused on stacked 3D-ICs

Hsueh Hsien Hsu, Tao Chih Chang, Chih Chen, Hsin Yi Lee, Albert T. Wu

研究成果: 書貢獻/報告類型會議論文篇章同行評審

1 引文 斯高帕斯(Scopus)

摘要

For the feature of "slim and light" in portable devices, stacked 3D-IC architecture was introduced in the advanced packaging techniques. The traditional FR-4 substrate was substituted by Si substrates. In general, the thickness of Si chip and substrates would be larger than 300 micron. However, silicon is rigid and has high resistance of deformation. Therefore, the thermal stress caused by the thermal expansion mismatch between Si chip, underfill and FR-4 substrate are less important due to both the chip and substrate side are rigid silicon. However, for future applications, silicon at chip and substrate sides should be thinned. The reliability issues caused by the stress become a serious issue. Furthermore, with increasing current density in the Si chip, the local heating caused by Joule heat becomes critical. In this study, thin 3D stacked chips stressed with the current density of 1×104 A/cm2 were investigated at different temperatures by using in-situ synchrotron radiation X-ray diffraction method. Owing to high resolution of synchrotron radiation X-ray, the results showed that the local heating caused by the electrical current is obvious; it affects the stress distribution in the chips. At different temperatures, the effects become complex and the properties of underfill could seriously affect the stress state in the chips.

原文???core.languages.en_GB???
主出版物標題International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
出版狀態已出版 - 2010
事件2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
持續時間: 20 10月 201022 10月 2010

出版系列

名字International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings

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???event.eventtypes.event.conference???2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
國家/地區Taiwan
城市Taipei
期間20/10/1022/10/10

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