Electrical and microstructure characteristics of SU8–Cu composite thin film fabricated using femtosecond laser direct writing

Keyphrases

• Scanning Speed 100%
• Microstructural Characteristics 100%
• Electrical Characteristics 100%
• Composite Thin Film 100%
• Femtosecond Laser Direct Writing 100%
• Microstructure 66%
• Laser Power 66%
• Surface Morphology 33%
• Electrical Conductivity 33%
• Copper Chloride 33%
• Low Speed 33%
• Two-photon Absorption 33%
• Cost-effectiveness 33%
• Composite Materials 33%
• Ablation 33%
• Highly Conductive 33%
• Excellent Electrical Conductivity 33%
• Bisphenol A 33%
• Electrical Resistance 33%
• Heat Accumulation 33%
• Copper Particles 33%
• Copper Ions 33%
• Photopatterning 33%
• Copper Sintering 33%
• Castable 33%
• Composite Solution 33%
• Copper Precursor 33%
• Conductive Composites 33%
• Glycidyl Ether 33%
• Copper(II) Nitrate Trihydrate 33%
• Femtosecond Laser Irradiation 33%
• Electrical Cost 33%
• Composite Microstructure 33%

Engineering

• Thin-Film Composite 100%
• Multiphoton Lithography 100%
• Femtosecond Laser 100%
• Scanning Speed 75%
• Laser Power 50%
• Line Width 50%
• Electrical Conductivity 50%
• Thin Films 25%
• Surface Morphology 25%
• Conductive 25%
• Polymerization 25%
• Laser Irradiation 25%
• Bisphenol 25%
• Composite Material 25%
• Sintering 25%

Material Science

• Thin Films 100%
• Composite Material 100%
• Electrical Conductivity 50%
• Linewidth 50%
• Composite Material 25%
• Surface Morphology 25%
• Polymerization 25%
• Copper Ion 25%
• Electrical Resistance 25%
• Sintering 25%