Effects of SiC_p reinforcement by electroless copper plating on properties of Cu/SiC_p composites

Silicon carbide reinforced copper matrix composites containing 50-80 vol.-%SiC_p were fabricated by hot pressing copper coated SiC_p powder. The results show that the densification, thermal expansion coefficients, flexural strength, and thermal conductivity of Cu/SiC_p composites reinforced by electroless copper plating and their corrosion resistance in 5%NaCl solution are better than those without electroless plating. Physical properties and flexural strength of the composites decrease with an increase in SiC_p content, whereas the corrosion resistance increases with an increase in SiC_p volume fraction. By observing the fracture surface after a flexural test, it can be seen there are two types of fracture model: the cracking of Cu/SiC_p interface and the pulling out of SiC_p particles. The experiment also proved that the bonding strength of the Cu/SiC_p interface and the pressure of the hot pressing operation are the two main factors which influence the fracture of these composites.