Effects of Cu content on electrochemical response in Ti-based metallic glasses under simulated body fluid

  • C. H. Huang
  • , J. J. Lai
  • , J. C. Huang
  • , C. H. Lin
  • , J. S.C. Jang

研究成果: 雜誌貢獻 › 期刊論文 › 同行評審

17 引文 斯高帕斯（Scopus）

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Engineering

Material Science

Chemical Engineering