Effects of Al additive on the mechanical and physical properties of silicon reinforced copper matrix composites

Engineering & Materials Science

• Physical properties 100%
• Copper 90%
• Silicon 87%
• Thermal expansion 85%
• Thermal conductivity 75%
• Mechanical properties 72%
• Composite materials 64%
• Packaging materials 37%
• Electronics packaging 35%
• Powder metallurgy 32%
• Strength of materials 29%
• Volume fraction 25%
• Powders 22%
• Aluminum 21%

Physics & Astronomy

• physical properties 87%
• copper 79%
• mechanical properties 74%
• thermal expansion 72%
• composite materials 68%
• thermal conductivity 65%
• matrices 61%
• silicon 60%
• coefficients 45%
• electronic packaging 39%
• powder metallurgy 32%
• aluminum 19%

Chemical Compounds

• Thermal Expansion 89%
• Thermal Conductivity 79%
• Additive 75%
• Composite Material 55%
• Packaging Material 34%
• Powder Metallurgy 33%
• Strength 17%
• Volume 16%