Effects of Al additive on the mechanical and physical properties of silicon reinforced copper matrix composites

Keyphrases

• Physical Properties 100%
• Mechanical Properties 100%
• Reinforced 100%
• Copper Matrix Composites 100%
• Al Additive 100%
• Low Coefficient of Thermal Expansion 66%
• High Thermal Conductivity 66%
• Vol% 33%
• Si Particles 33%
• Thermal Conductivity 33%
• Coefficient of Thermal Expansion 33%
• Mechanical Strength 33%
• Aluminum Powder 33%
• Particle Volume Fraction 33%
• Thermal Low 33%
• Powder Metallurgy Method 33%
• Electronic Packaging Materials 33%

Material Science

• Silicon 100%
• Thermal Conductivity 100%
• Thermal Expansion 100%
• Matrix Composite 100%
• Physical Property 100%
• Composite Material 66%
• Aluminum 33%
• Volume Fraction 33%
• Powder Metallurgy 33%
• Packaging Material 33%