Effects of Al additive on the mechanical and physical properties of silicon reinforced copper matrix composites

Yuang Fa Lee, Sheng Long Lee

研究成果: 雜誌貢獻期刊論文同行評審

14 引文 斯高帕斯(Scopus)

摘要

Silicon reinforced copper matrix composites exhibit high thermal conductivity and low coefficient of thermal expansion (CTE) by combining the high thermal conductivity of copper and the low CTE of silicon. To this end, a study was conducted on a copper matrix composite containing a high Si particle volume fraction in the range from 50% to 80% using a powder metallurgy method. The study focused on the effects of 5-10 vol% aluminum powder added to the matrix. The feasibility of the Cu/Sip composites for electronic packaging materials is based on a study determining the mechanical strength, the thermal conductivity and the CTE of the CuSip composites.

原文???core.languages.en_GB???
頁(從 - 到)773-778
頁數6
期刊Scripta Materialia
41
發行號7
DOIs
出版狀態已出版 - 30 8月 1999

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