摘要
As current-stressing a Cu/Sn joint interface, the Cu atoms in the interfacial cathode Cu-Sn compound would experience the direct electromigration force and chemical potential force simultaneously, which have never been decoupled. In this work, a triple-junction Cu-Sn-Cu joint was designed and current-stressed to separate the above electromigration and chemical forces imposed on the Cu atoms in the Cu-Sn compound. In addition, by obtaining the individual value of the electromigration Cu flux in the cathode Cu 6Sn5 compound layer, the effective charge number (Z*) of Cu atoms in the Cu6Sn5 compound can be determined to be 35.6.
原文 | ???core.languages.en_GB??? |
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頁(從 - 到) | P73-P75 |
期刊 | ECS Solid State Letters |
卷 | 1 |
發行號 | 5 |
DOIs | |
出版狀態 | 已出版 - 2012 |