Effective charge number of Cu in Cu-Sn compound

C. T. Lu, Y. J. Hu, Y. S. Liu, T. S. Huang, H. W. Tseng, C. Y. Chen, C. Y. Liu

研究成果: 雜誌貢獻期刊論文同行評審

2 引文 斯高帕斯(Scopus)

摘要

As current-stressing a Cu/Sn joint interface, the Cu atoms in the interfacial cathode Cu-Sn compound would experience the direct electromigration force and chemical potential force simultaneously, which have never been decoupled. In this work, a triple-junction Cu-Sn-Cu joint was designed and current-stressed to separate the above electromigration and chemical forces imposed on the Cu atoms in the Cu-Sn compound. In addition, by obtaining the individual value of the electromigration Cu flux in the cathode Cu 6Sn5 compound layer, the effective charge number (Z*) of Cu atoms in the Cu6Sn5 compound can be determined to be 35.6.

原文???core.languages.en_GB???
頁(從 - 到)P73-P75
期刊ECS Solid State Letters
1
發行號5
DOIs
出版狀態已出版 - 2012

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