Diamond heat spreader layer for high-power thin-GaN light-emitting diodes

Po Han Chen, Ching Liang Lin, Y. K. Liu, Te Yuan Chung, Cheng Yi Liu

研究成果: 雜誌貢獻期刊論文同行評審

34 引文 斯高帕斯(Scopus)

摘要

A diamond-coating layer is studied as a heat spreading layer for a thin-GaN light-emitting diode (LED) chip. Our results show that this diamond layer can effectively spread the heat and improve the temperature uniformity of a thin-GaN LED chip, which enhances the heat dissipation efficiency down to the heat sink.With the diamond heat spreading layer, the junction temperature of the thin-GaN LED was reduced by 20 °C at 1-A current input and the uniformity of the temperature distribution is also greatly improved.

原文???core.languages.en_GB???
頁(從 - 到)845-847
頁數3
期刊IEEE Photonics Technology Letters
20
發行號10
DOIs
出版狀態已出版 - 15 5月 2008

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