Development pattern recognition model for the classification of circuit probe wafer maps on semiconductors

Cheng Wei Chang, Tsung Ming Chao, Jorng Tzong Horng, Chien Feng Lu, Rong Hwei Yeh

研究成果: 雜誌貢獻期刊論文同行評審

17 引文 斯高帕斯(Scopus)

摘要

Spatial defect patterns generated during integrated circuit (IC) manufacturing contain valuable information on the fabrication process and can help engineers identify the root causes of any defect. Classification of these defect patterns is crucial to improving reliability and yield during IC manufacturing. Accurate classification requires good feature selection in order to assist in identifying the defect cluster types. In this paper, we demonstrate that the linear Hough transformation, the circular Hough transformation incorporating the cover ratio approach, and the zone ratio approach, when used as feature-extraction techniques, are able to distinguish lines, various solid circle-like cluster patterns such as blobs and bull's-eyes, and various hollow circle-like cluster patterns such as rings and edges. On the basis of these features, in this paper we provide a comprehensive evaluation of several data-mining classification approaches in terms of performance and accuracy. The results obtained using both artificial and real manufacturing data demonstrate the potential of this approach for analyzing general defect patterns that are generated during the IC fabrication process.

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文章編號6336797
頁(從 - 到)2089-2097
頁數9
期刊IEEE Transactions on Components, Packaging and Manufacturing Technology
2
發行號12
DOIs
出版狀態已出版 - 2012

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